The paper deals with the performance analysis of global-level on-chip interconnects. Two innovative solutions are presented, based on carbon solutions, and compared to conventional copper realization. These solutions involve the use of Carbon Nanotubes or Graphene Nanoribbons. A simple circuit equivalent model is presented for these interconnects, which can properly account for the geometrical properties of the carbon interconnects and for their temperature. Using this model, an analysis of the electrical performance of global level on-chip interconnects is carried out, referring to the 22nm technology node.

A temperature-dependent circuit model for carbon-based on-chip global interconnects

CHIARIELLO, Andrea Gaetano;
2012

Abstract

The paper deals with the performance analysis of global-level on-chip interconnects. Two innovative solutions are presented, based on carbon solutions, and compared to conventional copper realization. These solutions involve the use of Carbon Nanotubes or Graphene Nanoribbons. A simple circuit equivalent model is presented for these interconnects, which can properly account for the geometrical properties of the carbon interconnects and for their temperature. Using this model, an analysis of the electrical performance of global level on-chip interconnects is carried out, referring to the 22nm technology node.
978-1-4673-2198-3
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11591/177351
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